The Board of Directors of JF TECH is pleased to announce that its wholly-owned subsidiary, JF Microtechnology Sdn. Bhd. (“JFM”), has been granted a patent for an invention titled “Electrical Interconnect Assembly”, Patent No. 195107 (“the Patent”) by the Singapore’s Registry of Patents on 22 May 2015.

This is the second patent that has been granted to JFM as patent owner of its key product, namely ZIGMA products. JFM’s first patent was granted by the United States Patent an Trademark Office (“USPTO”) on 10 February 2015.

The tenure for this patent is for a period of twenty (20) years commencing from the date of application, 27 May 2011.

This announcement is dated 1 June 2015.