General Announcement for PLC
25/07/2022OTHERS COMINTEL CORPORATION BHD ("Comcorp" or the "Company") ACCEPTANCE OF LETTER OF AWARD FOR CONSTRUCTION AND COMPLETION OF PILING, PILE CAP AND LOWEST BASEMENT WORKS AMOUNTING TO RM52,825,000.00 FROM MIGHTYPROP SDN BHD
| COMINTEL CORPORATION BHD |
| Type | Announcement |
| Subject | OTHERS |
| Description | COMINTEL CORPORATION BHD ("Comcorp" or the "Company")
ACCEPTANCE OF LETTER OF AWARD FOR CONSTRUCTION AND COMPLETION OF PILING, PILE CAP AND LOWEST BASEMENT WORKS AMOUNTING TO RM52,825,000.00 FROM MIGHTYPROP SDN BHD |
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The Board of Directors of the Company wishes to announce that its wholly-owned subsidiary, Total Package Work Sdn Bhd has on 25 July 2022 accepted a letter of award for Construction And Completion Of Piling, Pile Cap And Lowest Basement Works amounting to RM52,825,000.00 from Mightyprop Sdn Bhd in respect of a proposed development on Plot 9 Phase 3 comprising one (1) block of forty eight (48) storey (671 units) serviced apartments with garden and water tank on the roof top level above the five floors of podium comprising facilities, business space (27 units), 1 unit 11kv substation and carpark as well as four (4) levels of basement parking on PT51805 (HSD 323241) and partial of PT51810 (HSD323246), Damansara Perdana, Mukim Sungai Buloh, Daerah Petaling, Selangor. Details of the announcement are set out in the file attached. This announcement is dated 25 July 2022.
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Please refer attachment below.
Attachments
Award from Mightyprop 52.825m.pdf
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Announcement Info
| Company Name | COMINTEL CORPORATION BHD |
| Stock Name | COMCORP |
| Date Announced | 25 Jul 2022 |
| Category | General Announcement for PLC |
| Reference Number | GA1-25072022-00025 |