General Announcement for PLC
27/05/2022OTHERS COMINTEL CORPORATION BHD ("Comcorp" or the "Company") ACCEPTANCE OF LETTER OF AWARD FOR CONSTRUCTION AND COMPLETION OF PILING, PILE CAP AND LOWEST BASEMENT WORKS AMOUNTING TO RM42,825,000.00 FROM MIGHTYPROP SDN BHD
| COMINTEL CORPORATION BHD |
| Type | Announcement |
| Subject | OTHERS |
| Description | COMINTEL CORPORATION BHD ("Comcorp" or the "Company")
ACCEPTANCE OF LETTER OF AWARD FOR CONSTRUCTION AND COMPLETION OF PILING, PILE CAP AND LOWEST BASEMENT WORKS AMOUNTING TO RM42,825,000.00 FROM MIGHTYPROP SDN BHD |
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The Board of Directors of Comintel Corporation Bhd wishes to announce that its wholly-owned subsidiary, Total Package Work Sdn Bhd has on 27 May 2022 accepted a letter of award for Construction And Completion Of Piling, Pile Cap And Lowest Basement Works amounting to RM42,825,000.00 from Mightyprop Sdn Bhd in respect of a proposed development comprising phase 2: one (1) block of forty eight (48) storey (767 units) serviced apartments with garden and water tank on the roof top level above the five floors of podium comprising facilities, business space (25 units), 1 unit 11kv substation and carpark as well as four (4) levels of basement parking on PT51805 (HSD 323241) and partial of PT51810 (HSD 323246), Damansara Perdana, Mukim Sungai Buloh, Daerah Petaling, Selangor.
Details of the announcement are set out in the file attached.
This announcement is dated 27 May 2022.
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Please refer attachment below.
Attachments
Award from Mightyprop 42.825m.pdf
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Announcement Info
| Company Name | COMINTEL CORPORATION BHD |
| Stock Name | COMCORP |
| Date Announced | 27 May 2022 |
| Category | General Announcement for PLC |
| Reference Number | GA1-27052022-00046 |